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Chapter 5 other questions part 2

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omegametroi0's version from 2017-10-09 21:49

Section

Question Answer
Which of the following processor features is used to dynamically reduce power consumption based on current operating conditions? Throttling
Where should the thermal paste go when installing a processor? Between the heat sink and the CPU
which of the following actions is not recommended for keeping your computer cool?Remove unused expansion card slot convers
You have a system that has been overheating. which of the following actions will not help to keep the system cool?removing the case side panel
What is the correct order for installing a processor for proper cooling?CPU,thermal paste, heat sink, fan
Which of the following accurately describes case fans? (select two)create a pressurized system inside the case and pull cool air from the front and blow out hot air out the back
Which of the following will ensure optimal system cooling? (select three.)Keep the Ambient temperature (surrounding temperature) below 80F , bundle cables together and secure cables to the case and leave space between the case and any walls of obstructions..
Which of the following characteristics accurately describe passive heat sinks?more reliable tan active heat sinks
Which of the following thermal solutions might you find on memory modules?passive heat sink
To which of the following objects should thermal past by applied?CPU
YOu have just finished upgrading the CPU in you desltop system. AFter running the system for about 10 minutes, the system locks up and automatically restarts. Which should you do first to troubleshoot the problem?(select 2)Check the CPU fan power and make sure the heat sink is properly mounted and has thermal paste.
You have a systme that has been overheating and shutting off. which of the following action will not help to keep the system cool?removing the side panel from the case.
Which of the following would most likely cause random system lockups?overheated processor
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